Aehr Test Systems

Aehr Test Systems provides test systems for burningin and testing logic optical and memory integrated circuits worldwide It offers products such as the ABTS and FOXP families of test and burnin systems and FOX WaferPak Aligner FOXXP WaferPak Contactor FOX DiePak Carrier and FOX DiePak Loader The ABTS system is used in production and qualification testing of packaged parts for lower power and higher power logic devices as well as various common types of memory devices The FOXXP and FOXNP systems are wafer contact and singulated diemodule test and burnin systems used for burnin and functional test of complex devices such as memories digital signal processors microprocessors microcontrollers systemsonachip and integrated optical devices The FOXCP system is a singlewafer compact test and reliability verification solution for logic memory and photonic devices The WaferPak Contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burnin of full wafers on Aehr Test FOX systems The DiePak Carrier is a reusable temporary package that enables IC manufacturers to perform final test and burnin of bare die and modules Aehr Test Systems was incorporated in 1977 and is headquartered in Fremont California